IC Industry
Optical communication ceramic heat sink
We can provide ceramic heat dissipation substrates for application in the field of optical communication according to customer needs. At the same time, the ceramic substrate can integrate thin film resistors and pre-set AuSn solder, etc.
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Substrate materials: AlN, SiC, Al2O3, etc
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Pattern and size: can be customized according to customer needs
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Conductive layer: Standard film structure and thickness: Ti 0.1μm/Pt 0.2μm/Au 0.5μm (Nom)， Other membrane structures and thicknesses can be customized according to customer needs
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AuSn solder layer: standard process Au (75 ± 5wt%) Sn, proportion and thickness can be customized according to customer needs
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Thin film resistor: Square resistance accuracy Min ± 3%, TCR: -100 ± 50 ppm/℃
Graphic accuracy:< ±10μm
Keywords: Optical Communication Ceramic Heat Sink
Optical communication ceramic heat sink
We can provide ceramic heat dissipation substrates for application in the field of optical communication according to customer needs. At the same time, the ceramic substrate can integrate thin film resistors and pre-set AuSn solder, etc.
·
·
Substrate materials: AlN, SiC, Al2O3, etc
·
Pattern and size: can be customized according to customer needs
·
Conductive layer: Standard film structure and thickness: Ti 0.1μm/Pt 0.2μm/Au 0.5μm (Nom)， Other membrane structures and thicknesses can be customized according to customer needs
·
AuSn solder layer: standard process Au (75 ± 5wt%) Sn, proportion and thickness can be customized according to customer needs
·
Thin film resistor: Square resistance accuracy Min ± 3%, TCR: -100 ± 50 ppm/℃
Graphic accuracy:< ±10μm
Keywords: Optical Communication Ceramic Heat Sink
Semiconductor laser ceramic heat sink
We can provide high thermal conductivity heat sink products suitable for COS packaging process of semiconductor lasers. The products have high reliability and good solder stability, providing solutions for heat dissipation of high-power semiconductor laser chips, electrode connection, solder presetting, and assembly positioning problems.
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Substrate materials: AlN, BeO, SiC, etc
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Pattern and size: can be customized according to customer needs
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Metal layer: Standard process Cu/Ni/Au, with a Cu layer thickness of 75 ± 15 μ m and an Au layer that meets wire bonding requirements. Other film structures and thicknesses can be customized according to customer needs
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AuSn solder layer: standard process Au (75 ± 5wt%) Sn, proportion and thickness can be customized according to customer needs
Solder layer graphic accuracy: ± 30 μ m
Keywords: Semiconductor laser ceramic heat sink
Semiconductor laser ceramic heat sink
We can provide high thermal conductivity heat sink products suitable for COS packaging process of semiconductor lasers. The products have high reliability and good solder stability, providing solutions for heat dissipation of high-power semiconductor laser chips, electrode connection, solder presetting, and assembly positioning problems.
·
·
Substrate materials: AlN, BeO, SiC, etc
·
Pattern and size: can be customized according to customer needs
·
Metal layer: Standard process Cu/Ni/Au, with a Cu layer thickness of 75 ± 15 μ m and an Au layer that meets wire bonding requirements. Other film structures and thicknesses can be customized according to customer needs
·
AuSn solder layer: standard process Au (75 ± 5wt%) Sn, proportion and thickness can be customized according to customer needs
Solder layer graphic accuracy: ± 30 μ m